SMTA Empire Expo 2019 Technical Program

We are thrilled to confirm 30+ year industry legends Dave Hillman and Doug Pauls from Rockwell Collins will be the featured speakers at our Annual Expo Event on Tuesday April 9, 2019 at the Holiday Inn Syracuse-Liverpool, NY location. Your participation is requested to take this short 3 question survey to help us identify the technical presentation topics you want to hear about. Please check back to the SMTA Empire Chapter web page for updates about the Expo program and to register your attendance at https://www.smta.org/chapters/chapters_detail.cfm?chapter_id=26

NOTE: This survey will close at 6:00pm on Thursday February 28, 2019

Question Title

* 1. Please rank these four headline topic categories from 1 to 4 (1 is most preferred, 4 is least preferred)

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* 2. Select your top 5 presentation titles from the following list:

1, (Cleaning / Residues), "Evaluating Masking Residues"

2, (Cleaning / Residues), "Ion Chromatography Overview"

3, (Cleaning / Residues), "J-STD-001G Amendment 1 Process Qualification"

4, (Cleaning / Residues), "Localized Extraction Techniques"

5, (Cleaning / Residues), "Residue Assessment, Impact and Control in Manufacturing High-Performance Products"

6, (Conformal Coating), "Development of a Nanocoat Process Control Methodology"

7, (Conformal Coating), "Impact of Foreign Objects and Debris on Conformal Coating"

8, (Conformal Coating), "Impact of Improper Conformal Coating Processes and BGA Pb Free Solder Joints"

9, (Conformal Coating), "Impact of Improper Conformal Coating Processes and BGA Tin/Lead Solder Joints"

10, (Conformal Coating), "IPC Conformal Coating Material & Application “State of the Industry” Assessment Project Report"

11, (Conformal Coating), "Robust Coating Processes In The Factory Methods, Critical Parameters, Problems and Remedies"

12, (Pb Free), "Dissolution Rate of Specific Elements in SAC305 Solder"

13, (Pb Free), "Effect Of Bismuth, Antimony, Or Indium On The Thermal Fatigue Of High Reliability Pb Free Solder Alloys"

14, (Pb Free), "NASA DoD Phase II Pbfree Soldering Project"

15, (Pb Free), "Top 5 Pb Free Boogiemen"

16, (Pb Free), "Utilization Of Pb Free Ball Grid Arrays (BGAs) in a Tin/Lead Soldering Process"

17, (Reliability), "BGAs Reliability and Voids"

18, (Reliability), "High I/O BGA Connector Solder Joint Integrity Investigation"

19, (Reliability), "Hold My Circuit Board and Watch This! The Consequences of Poor Design and Assembly Decisions for High Performance Electronics"

20, (Reliability), "Plated Through Hole Solder Joints and Gold Embrittlement"

21, (Reliability), "QFN Reliability and Voids"

22, (Reliability), "Tin Whiskers"

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* 3. If you prefer to see a presentation discussing another SMT (design, material, assembly, inspection, yield/reliability, etc..) topic please specify that here, otherwise leave blank and click "DONE" to exit the survey.